What is the primary purpose of maintaining substrate temperatures after TFIFRM application?

Maintaining substrate temperatures after the application of Thermal Fire-Resistant Material (TFIFRM) is essential for ensuring proper adhesion. The adhesion of fireproofing materials to substrates significantly impacts their effectiveness in protecting structural elements during a fire. If the substrate temperature is too low, it can affect the curing process and the ability of the fireproofing material to bond correctly. This adhesion is crucial as it ensures that the fireproofing remains securely attached, thereby providing the necessary protective barrier. Proper adhesion helps in maintaining the structural integrity of the building materials in the event of a fire, contributing to overall safety.